Interactive GitHub Pages map of the memory supply chain. The lines show how front-end memory capex, HBM packaging, test/probe, backend services, and AI storage nodes feed into each other. Click a company to see why it matters, what it depends on, and where the real choke points sit.
Front-end memory equipment and process positions that feed both HBM and storage expansions.
Bonding, molding, and packaging-step vendors where capacity can tighten after wafers are made.
Probe, test, OSAT, and memory-backend nodes that determine what actually ships as qualified product.
The manufacturers and controller layer that turn process capacity into usable HBM, NAND, and SSDs.
Where the cycle monetizes: AI accelerators, hyperscalers, and storage-heavy inference infrastructure.