Memory Supercycle — Interlinked Chokepoint Map

Interactive GitHub Pages map of the memory supply chain. The lines show how front-end memory capex, HBM packaging, test/probe, backend services, and AI storage nodes feed into each other. Click a company to see why it matters, what it depends on, and where the real choke points sit.

BUY rated
HOLD rated
Chokepoint
HBM chain link
AI storage link
Backend / capacity link
HBM Compute Chain
AI Storage Chain

Shared Upstream

Front-end memory equipment and process positions that feed both HBM and storage expansions.

Packaging Tools

Bonding, molding, and packaging-step vendors where capacity can tighten after wafers are made.

Test & Backend

Probe, test, OSAT, and memory-backend nodes that determine what actually ships as qualified product.

Memory Suppliers

The manufacturers and controller layer that turn process capacity into usable HBM, NAND, and SSDs.

Demand Anchors

Where the cycle monetizes: AI accelerators, hyperscalers, and storage-heavy inference infrastructure.

Lines represent the main dependency flow, not an exhaustive customer list. The map is designed to surface the narrowest and most strategically important points in the chain rather than every bilateral relationship.